Sonja Koller

9 Patents

• US126223192026

  Stacked Die Packaging Architecture with Conductive Vias on Interposer

  Intel Corporation

  0 cites
• US126047592026

  Microelectronic Assemblies Including Stiffeners Around Individual Dies

  Intel Corporation

  0 cites
• US125640582026

  Packaging Architecture with Reinforcement Structure in Package Substrate

  Intel Corporation

  0 cites
• US125507362026

  Packaging Architecture with Reinforcement Structure in Package Substrate

  Intel Corporation

  0 cites
• US122495532025

  Thermal Contacts at Periphery of Integrated Circuit Packages

  Intel Corporation

  0 cites
• US118774032024

  Printed Wiring-board Islands for Connecting Chip Packages and Methods of Assembling Same

  Intel Corporation

  0 cites
• US117841432023

  Single Metal Cavity Antenna in Package Connected to an Integrated Transceiver Front-end

  Intel Corporation

  0 cites
• US117641872023

  Semiconductor Packages, and Methods for Forming Semiconductor Packages

  Intel Corporation

  0 cites
• US116464982023

  Package Integrated Cavity Resonator Antenna

  Intel Corporation

  0 cites