3 Patents
- US125289062026Epoxy Compound, Composition Prepared Therefrom, Semiconductor Device Prepared Therefrom, Electronic Device Prepared Therefrom, Article Prepared Therefrom, and Method of Preparing Epoxy Compound
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US119266952024High-thermal Conductive Epoxy Compound and Composition, Material for Semiconductor Package, Molded Product, Electric and Electronic Device, and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118277412023Epoxy Compound, Composition Prepared Therefrom, Semiconductor Device Prepared Therefrom, Electronic Device Prepared Therefrom, Article Prepared Therefrom, and Method of Preparing Epoxy Compound
SAMSUNG ELECTRONICS CO., Ltd.
0 cites