4 Patents
- US126011022026Clothing Processing Device Including Heat Dissipation Sheet
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US125753772026Method and Tool for Restricting Substrate a Support Bead Inside an Opening Formed in a Substrate Support
Applied Materials, Inc.
0 cites - 0 cites
- US119963072024Semiconductor Processing Tool Platform Configuration with Reduced Footprint
Applied Materials, Inc.
0 cites