Patents/Inventors

Son Nguyen

Schenectady, NYUS23 patents

23 Patents

US126149822026
Dual-path Charge Pump
Silicon Storage Technology, Inc.
0 cites
US126086532026
Website Style Replicator
Appdirect, Inc.
0 cites
US125882612026
Selective Deposition on Metals Using Porous Low-k Materials
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US125639802026
Selective Deposition and Cross-linking of Polymeric Dielectric Material
International Business Machines Corporation
0 cites
US125572972026
Leveling Dielectric Surfaces for Contact Formation with Embedded Memory Arrays
International Business Machines Corporation
0 cites
US124761442025
Etch Back and Film Profile Shaping of Selective Dielectric Deposition
International Business Machines Corporation
0 cites
US124463062025
Stacked Field Effect Transistor Structure with Independent Gate Control Between Top and Bottom Gates
International Business Machines Corporation
0 cites
US124380392025
Air Gap in Beol Interconnect
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites
US124190792025
Field Effect Transistor with Backside Source/drain
International Business Machines Corporation
0 cites
US123879372025
Sam Formulations and Cleaning to Promote Quick Depositions
International Business Machines Corporation
0 cites
USD10717602025
Wearable Sensor Adhesive Patch
ZYWIE Inc.
0 cites
USD10717612025
Wearable Sensor Adhesive Patch
ZYWIE Inc.
0 cites
USD10717592025
Wearable Biological Sensor
ZYWIE Inc.
0 cites
USD10706192025
Wearable Sensor Adhesive Patch
ZYWIE Inc.
0 cites
USD10697982025
Wearable Sensor Docking Station
ZYWIE Inc.
0 cites
US122063252025
Pumping Controller for a Plurality of Charge Pump Units
SILICON STORAGE TECHNOLOGY, Inc.
0 cites
US121023162024
Devices and Methods of Visualizing and Determining Depth of Penetration in Cardiac Tissue
ANCORA HEART, Inc.
0 cites
US120828132024
Multi-window Guide Tunnel
ANCORA HEART, Inc.
0 cites
US119424262024
Semiconductor Structure Having Alternating Selective Metal and Dielectric Layers
International Business Machines Corporation
0 cites
US119087342024
Composite Interconnect Formation Using Graphene
International Business Machines Corporation
0 cites
US117913982023
Nano Multilayer Carbon-rich Low-k Spacer
International Business Machines Corporation
0 cites
US117567862023
Forming High Carbon Content Flowable Dielectric Film with Low Processing Damage
International Business Machines Corporation
0 cites
US115574642023
Semiconductor Chamber Coatings and Processes
Applied Materials, Inc.
0 cites