13 Patents
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- US123744972025Multilayer Electronic Component with Improved Reliability
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
0 cites - US123548032025Multilayer Electronic Component Having Structure for Improved Adhesion Force and Moisture Protection
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US122550222025Multilayer Electronic Component Having Insulating Layer Which Includes Fluorine-based Organic Material
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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- US119962402024Electronic Component Having a Body and Sealing Thin Film Disposed in a Microhole of the Body
SAMSUNG ELECTRO-MECHANICS CO., Ltd.
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