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Inventors
Sivachandra Jangam
Milpitas, CA
US
4 patents
5 Patents
US12494468
2025
3D System and Wafer Reconstitution with Mid-layer Interposer
Apple Inc.
0 cites
US12424455
2025
Seal Ring Designs Supporting Efficient Die to Die Routing
Apple Inc.
0 cites
US12261132
2025
Structure and Method for Sealing a Silicon IC
Apple Inc.
0 cites
US11862481
2024
Seal Ring Designs Supporting Efficient Die to Die Routing
Apple Inc.
0 cites
US11824015
2023
Structure and Method for Sealing a Silicon IC
Apple Inc.
0 cites