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Sireesha Gogineni
Folsom, CA
US
3 patents
4 Patents
US12046581
2024
Integrated Circuit Package with Glass Spacer
Intel Corporation
0 cites
US11881441
2024
Stacked Die Semiconductor Package Spacer Die
Intel Corporation
0 cites
US11848292
2023
Pad Design for Thermal Fatigue Resistance and Interconnect Joint Reliability
Intel Corporation
0 cites
US11694976
2023
Bowl Shaped Pad
Intel Corporation
0 cites