Patents/Inventors

Siping Hu

HubeiCN9 patents

8 Patents

US125074062025
3D Memory Device
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
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US121365992024
Three-dimensional Memory Devices and Fabricating Methods Thereof
Yangtze Memory Technologies Co., Ltd.
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US121333862024
Contact Pads of Three-dimensional Memory Device and Fabrication Method Thereof
Yangtze Memory Technologies Co., Ltd.
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US120894062024
Three-dimensional Memory Device Comprising Contact Pads Exposed by an Opening Passing Through Layer Stack and Fabrication Method Thereof
Yangtze Memory Technologies Co., Ltd.
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US120806972024
Method for Forming a Three-dimensional (3D) Memory Device Having Bonded Semiconductor Structures
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
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US119787192024
Metal-dielectric Bonding Method and Structure
Yangtze Memory Technologies Co., Ltd.
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US118429112023
Wafer Stress Control Using Backside Film Deposition and Laser Anneal
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
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US117989132023
Metal-dielectric Bonding Method and Structure
YANGTZE MEMORY TECHNOLOGIES CO., Ltd.
0 cites