Patents/Inventors

Siping Bai

ZhuhaiCN1 patent

2 Patents

US119177682024
Single-layer Circuit Board, Multi-layer Circuit Board, and Manufacturing Methods Therefor
RICHVIEW ELECTRONICS CO., Ltd.
0 cites
US115526172023
Microwave Dielectric Component and Manufacturing Method Thereof
RICHVIEW ELECTRONICS CO., Ltd.
0 cites