Patents/Inventors

Simon Dong

ShanghaiCN2 patents

3 Patents

US124827612025
Semiconductor Device Package Having Improved Conductive Stub Coverage
SANDISK TECHNOLOGIES, Inc.
0 cites
US120626252024
Semiconductor Device Package Mold Flow Control System and Method
SANDISK TECHNOLOGIES, Inc.
0 cites
US119424592024
Semiconductor Device Package with Exposed Bond Wires
Western Digital Technologies, Inc.
0 cites