8 Patents
- 0 cites
- US121702392024Direct Bonded Copper Substrates Fabricated Using Silver Sintering
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US121600602024Bonding Module Pins to an Electronic Substrate
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - US119423692024Thin Semiconductor Package for Notched Semiconductor Die
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - 0 cites
- US117768702023Direct Bonded Copper Substrates Fabricated Using Silver Sintering
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites - 0 cites
- US116266772023Bonding Module Pins to an Electronic Substrate
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites