Patents/Inventors

Shu Qin

Boise, IDUS2 patents

4 Patents

US120401822024
Plasma Doping of Gap Fill Materials
Micron Technology, Inc.
0 cites
US120402112024
Devices, Systems and Methods for Electrostatic Force Enhanced Semiconductor Bonding
Micron Technology, Inc.
0 cites
US116580332023
Methods of Forming Assemblies Having Heavily Doped Regions
Micron Technology, Inc.
0 cites
US115748342023
Devices, Systems and Methods for Electrostatic Force Enhanced Semiconductor Bonding
Micron Technology, Inc.
0 cites