Patents/Inventors

Shu-jung Tseng

Taichung CountyTW4 patents

5 Patents

US124698342025
Semiconductor Package and Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123680922025
Package Substrate Insulation Opening Design
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121070382024
Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118173822023
Package Substrate Insulation Opening Design
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116005622023
Semiconductor Packages and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites