15 Patents
- 0 cites
- US124697452025Conductive Structures with Bottom-less Barriers and Liners
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123947172025Graphite-based Interconnects and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123549582025Semiconductor Devices and Methods of Formation
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123343972025Interconnect Structure Including Graphite and Method Forming Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123226492025Interconnect Structure of Semiconductor Device
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123157642025Conductive Structures with Barriers and Liners of Varying Thicknesses
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122551442025Graphene Liners and Caps for Semiconductor Structures
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122372612025Semiconductor Device Having a Contact Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121659752024Method of Forming Interconnect Structure Having a Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120947702024Ruthenium-based Liner for a Copper Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117496042023Ruthenium Oxide Film and Ruthenium Liner for Low-resistance Copper Interconnects in a Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117422902023Interconnect Structure and Method of Forming Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116520442023Contact Structure and Method of Making
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites