Patents/Inventors

Shripad Gokhale

Gilbert, AZUS5 patents

6 Patents

US126160262026
Permanent Layer for Bump Chip Attach
Intel Corporation
0 cites
US124179582025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123947732025
Laser Ablation-based Surface Property Modification and Contamination Removal
Intel Corporation
0 cites
US123623402025
Laser Ablation-based Surface Property Modification and Contamination Removal
Intel Corporation
0 cites
US123477432025
Microelectronics Package Comprising a Package-on-package (pop) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and Pop Adhesive Keep Out Zone
Intel Corporation
0 cites
US123157772025
Microelectronics Package Comprising a Package-on-package (POP) Architecture with Inkjet Barrier Material for Controlling Bondline Thickness and POP Adhesive Keep Out Zone
Intel Corporation
0 cites