4 Patents
- US123410802025Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US119786892024Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US117568602023Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US115519972023Thermal Management Solutions Using Self-healing Polymeric Thermal Interface Materials
Intel Corporation
0 cites