Patents/Inventors

Shou-yi Wang

HsinchuTW3 patents

4 Patents

US122495642025
Package Structure, RDL Structure Comprising Redistribution Layer Having Ground Plates and Signal Lines
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121836822024
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119618142024
Integrated Circuit Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116705752023
Package Structure, RDL Structure Comprising Redistribution Layer Having Ground Plates and Signal Lines
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites