Shoichi Osada

2 Patents

• US123050362025

  Epoxy Resin Composition for Semiconductor Encapsulation and Semiconductor Device

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites
• US116394102023

  Heat-curable Resin Composition and Uses Thereof

  SHIN-ETSU CHEMICAL CO., Ltd.

  0 cites