13 Patents
- US125819512026Semiconductor Module Having a Plurality of Heat Sink Plates
MIRISE Technologies Corporation
0 cites - US124827202025Semiconductor Device Having Electric Component Built in Circuit Board
MIRISE Technologies Corporation
0 cites - 0 cites
- US120741132024Semiconductor Device Having Electric Component Built in Circuit Board
MIRISE Technologies Corporation
0 cites - US120480852024Power Electronics Cooling Assemblies and Methods for Making the Same
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites - US120150062024Semiconductor Device and Method of Manufacturing the Same
MIRISE Technologies Corporation
0 cites - 0 cites
- US118643232024Driver Board Assemblies and Methods of Forming a Driver Board Assembly
Toyota Jidosha Kabushiki Kaisha
0 cites - US118255942023Semiconductor Device Having Electric Component Built in Circuit Board
MIRISE Technologies Corporation
0 cites - US118027392023Cooling Assemblies Having Channels to Supply Fluid to Wick Structures
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites - US117768752023Systems Including a Vapor Chamber as the Heat Spreading Substrate of a Power Device Embedded in a PCB and Methods of Forming the Same
Toyota Jidosha Kabushiki Kaisha
0 cites - US116658132023Power Electronics Cooling Assemblies and Methods for Making the Same
TOYOTA JIDOSHA KABUSHIKI KAISHA
0 cites - US116020872023Double-sided Hybrid Cooling of PCB Embedded Power Electronics and Capacitors
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, Inc.
0 cites