Sho Kawadahara

6 Patents

• US120027002024

  Substrate Bonding Apparatus and Method of Manufacturing a Semiconductor Device

  Kioxia Corporation

  0 cites
• US119843282024

  Semiconductor Manufacturing Apparatus and Semiconductor Manufacturing Method

  Kioxia Corporation

  0 cites
• US117913052023

  Manufacturing Apparatus, Operation Method Thereof, and Method for Manufacturing Semiconductor Device

  KIOXIA CORPORATION

  0 cites
• US117769312023

  Substrate Bonding Apparatus, Manufacturing System, and Semiconductor Device Manufacturing Method

  Kioxia Corporation

  0 cites
• US116462392023

  Registration Mark, Positional Deviation Detection Method and Device, and Method for Manufacturing Semiconductor Device

  Kioxia Corporation

  0 cites
• US115519342023

  Wafer Separating Method

  Kioxia Corporation

  0 cites