Shiqun Gu

6 Patents

• US126047672026

  Chipset and Method of Manufacturing the Same

  Shanghai Biren Technology Co., Ltd

  0 cites
• US121548902024

  Multi-tier IC Package Including Processor and High Bandwidth Memory

  HUAWEI TECHNOLOGIES CO., Ltd.

  0 cites
• US120275122024

  Chipset and Manufacturing Method Thereof

  Shanghai Biren Technology Co., Ltd

  0 cites
• US117195842023

  Complementary Ring Oscillators to Monitor In-situ Stress Within Integrated Circuits

  Huawei Technologies Co., Ltd.

  0 cites
• US116887042023

  Merged Power Pad for Improving Integrated Circuit Power Delivery

  Futurewei Technologies, Inc.

  0 cites
• US115454672023

  IC Die to IC Die Interconnect Using Error Correcting Code and Data Path Interleaving

  Huawei Technologies Co., Ltd.

  0 cites