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Inventors
Shintaro Hashimoto
Tokyo
JP
4 patents
5 Patents
US12463190
2025
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
0 cites
US12412880
2025
Semiconductor Device Having Dolmen Structure and Method for Manufacturing Same
0 cites
US12074139
2024
Semiconductor Device Having Dolmen Structure and Manufacturing Method Therefor, and Support Piece Formation Laminate Film and Manufacturing Method Therefor
0 cites
US11935870
2024
Method for Manufacturing Semiconductor Device Having Dolmen Structure, Method for Manufacturing Support Piece, and Laminated Film
0 cites
US11581212
2023
Prepreg for Coreless Substrate, Coreless Substrate and Semiconductor Package
Showa Denko Materials Co., Ltd.
0 cites