Shintaro Araki

4 Patents

• US125576912026

  Semiconductor Device and Semiconductor Module Comprising a Polyimide Film Disposed in an Active Region and a Termination Region and a Passivation Film Disposed as a Film Underlying the Polyimide Film

  Mitsubishi Electric Corporation

  0 cites
• US125001352025

  Semiconductor Device Comprising Semiconductor Element; Insulating Component; Lead Electrode; and First Bonding Material, Second Bonding Material, Third Bonding Material, and Fourth Bonding Material Made of a Same Material

  Mitsubishi Electric Corporation

  0 cites
• US123410782025

  Semiconductor Device

  Mitsubishi Electric Corporation

  0 cites
• US116212132023

  Semiconductor Device Including a Spring Plate

  Mitsubishi Electric Corporation

  0 cites