Patents/Inventors

Shinji Tsuchikawa

TokyoJP1 patent

2 Patents

US121687092024
Thermosetting Resin Composition, Prepreg, Laminate, Metal-clad Laminate, Printed Wiring Board, and High-speed Communication Compatible Module
RESONAC CORPORATION
0 cites
US115812122023
Prepreg for Coreless Substrate, Coreless Substrate and Semiconductor Package
Showa Denko Materials Co., Ltd.
0 cites