Patents/Inventors

Shinji Maekawa

Tokyo-toJP1 patent

2 Patents

US121192932024
Through Electrode Substrate and Mounting Substrate
DAI NIPPON PRINTING CO., Ltd.
0 cites
US118108202023
Through Electrode Substrate, Method of Manufacturing Through Electrode Substrate, and Mounting Substrate
DAI NIPPON PRINTING CO., Ltd.
0 cites