Shinichirou Sukata

5 Patents

• US123549142025

  Method for Producing Substrate Having Through-silicon Vias, Substrate Having Through-silicon Vias, and Copper Paste for Through-silicon via Formation

  Resonac Corporation

  0 cites
• US122973772025

  Conductive Adhesive Composition, and Method for Producing Connection Structure

  0 cites
• US122472702025

  Anisotropic Conductive Film and Method for Producing the Anisotropic Conductive Film Including a Base Material Having Recesses and Solder Particles Formed Inside the Recesses

  RESONAC CORPORATION

  0 cites
• US121722402024

  Solder Particles

  RESONAC CORPORATION

  0 cites
• US120708002024

  Electronic Component and Method for Manufacturing Electronic Component

  RESONAC CORPORATION

  0 cites