9 Patents
- US123592842025Copper Alloy, Plastically Worked Copper Alloy Material, Component for Electronic/electrical Equipment, Terminal, Heat Dissipation Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US122644072025Cu—ni—si Based Copper Alloy Plate, Cu—ni—si Based Copper Alloy Plate with Plating Film, and Methods of Producing the Same
MITSUBISHI MATERIALS CORPORATION
0 cites - US122031582025Copper Alloy, Copper Alloy Plastic Working Material, Component for Electronic/electrical Device, Terminal, Bus Bar, Lead Frame, and Heat Dissipation Substrate
MITSUBISHI MATERIALS CORPORATION
0 cites - US119268892024Copper Alloy Plate, Copper Alloy Plate with Plating Film, and Methods for Producing These
MITSUBISHI MATERIALS CORPORATION
0 cites - US119202282024Copper Alloy Sheet, Copper Alloy Sheet with Plating Film, and Method for Producing Same
MITSUBISHI MATERIALS CORPORATION
0 cites - 0 cites
- US117955252023Copper Alloy Plate, Copper Alloy Plate with Plating Film, and Manufacturing Method Thereof
MITSUBISHI MATERIALS CORPORATION
0 cites - US117812342023Copper Alloy Plate, Plating Film-attached Copper Alloy Plate, and Methods Respectively for Manufacturing These Products
MITSUBISHI MATERIALS CORPORATION
0 cites - US115726332023Tin-plated Copper Terminal Material and Method of Manufacturing the Same
MITSUBISHI MATERIALS CORPORATION
0 cites