Patents/Inventors

Shingo Okamura

FukuokaJP1 patent

2 Patents

US124841572025
Adhesive for Provisionally Fixing Electronic Component to Solder Precoat and Method for Producing Electronic Component Mounted Substrate
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites
US124022552025
Method for Producing Electronic Component Mounted Substrate
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.
0 cites