Patents/Inventors

Shing-yih Shih

New Taipei CityTW46 patents

46 Patents

US126047112026
Semiconductor Device and Manufacturing Method Thereof
NANYA TECHNOLOGY CORPORATION
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US124827752025
Semiconductor Structure
NANYA TECHNOLOGY CORPORATION
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US124566302025
Method of Manufacturing Semiconductor Structure Having Heat Dissipation Structure
NANYA TECHNOLOGY CORPORATION
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US124567032025
Semiconductor Device Structure Including a Bonding Structure
NANYA TECHNOLOGY CORPORATION
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US124314102025
Semiconductor Device with Polymer Liner and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
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US123811672025
Semiconductor Structure Having Vias with Different Dimensions
NANYA TECHNOLOGY CORPORATION
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US123549652025
Semiconductor Device with Redistribution Structure and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
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US123477302025
Method of Manufacturing Semiconductor Structure Having Vias with Different Dimensions
NANYA TECHNOLOGY CORPORATION
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US123157742025
Semiconductor Structure Having Heat Dissipation Structure
NANYA TECHNOLOGY CORPORATION
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US123157962025
Method for Preparing Semiconductor Device with Composite Passivation Structure
NANYA TECHNOLOGY CORPORATION
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US122781902025
Manufacturing Method of Semiconductor Package Structure Having Interconnections Between Dies
NANYA TECHNOLOGY CORPORATION
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US122726202025
Semiconductor Structure Having Elastic Member Within Via
NANYA TECHNOLOGY CORPORATION
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US122726512025
Semiconductor Package Structure Having Interconnections Between Dies and Manufacturing Method Thereof
NANYA TECHNOLOGY CORPORATION
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US122665642025
Semiconductor Device
NANYA TECHNOLOGY CORPORATION
0 cites
US122059122025
Semiconductor Package Structure and Method for Preparing the Same
NANYA TECHNOLOGY CORPORATION
0 cites
US121989772025
Manufacturing Method of Semiconductor Structure Having Elastic Member Within Via
NANYA TECHNOLOGY CORPORATION
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US121912582025
Semiconductor Device Having Integral Alignment Marks with Decoupling Features and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
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US121425962024
Semiconductor Structure and Manufacturing Method Thereof
NANYA TECHNOLOGY CORPORATION
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US121006342024
Semiconductor Device with Re-fill Layer
NANYA TECHNOLOGY CORPORATION
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US119358162024
Conductive Feature with Non-uniform Critical Dimension and Method of Manufacturing the Same
NANYA TECHNOLOGY CORPORATION
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US119358312024
Semiconductor Device with Connecting Structure and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
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US119013342024
Microelectronic Devices Including Embedded Bridge Interconnect Structures
Micron Technology, Inc.
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US119013442024
Manufacturing Method of Semiconductor Package
NANYA TECHNOLOGY CORPORATION
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US118760632024
Semiconductor Package Structure and Method for Preparing the Same
NANYA TECHNOLOGY CORPORATION
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US118760792024
Method for Fabricating Semiconductor Device with Recessed Pad Layer
NANYA TECHNOLOGY CORPORATION
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US117988792023
Semiconductor Device with Composite Passivation Structure and Method for Preparing the Same
NANYA TECHNOLOGY CORPORATION
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US117658822023
Method for Fabricating Semiconductor Device
NANYA TECHNOLOGY CORPORATION
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US117422422023
Method for Manufacturing Through-silicon via with Liner
NANYA TECHNOLOGY CORPORATION
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US117354992023
Semiconductor Device with Protection Layers and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
0 cites
US117355402023
Apparatuses Including Dummy Dice
Micron Technology, Inc.
0 cites
US117282772023
Method for Manufacturing Semiconductor Structure Having via Through Bonded Wafers
NANYA TECHNOLOGY CORPORATION
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US117283162023
Method for Fabricating Semiconductor Device with Heat Dissipation Features
NANYA TECHNOLOGY CORPORATION
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US117106932023
Wafer Level Package Utilizing Molded Interposer
Micron Technology, Inc.
0 cites
US117053802023
Method for Fabricating Semiconductor Device with Protection Layers
NANYA TECHNOLOGY CORPORATION
0 cites
US116580632023
Method for Preparing Semiconductor Device Structure with Air Gap
NANYA TECHNOLOGY CORPORATION
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US116580702023
Method of Forming Semiconductor Structure
NANYA TECHNOLOGY CORPORATION
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US116462922023
Method for Fabricating Semiconductor Device with Re-fill Layer
NANYA TECHNOLOGY CORPORATION
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US116462992023
Method of Manufacturing a Semiconductor Package Including a First Sub-package Stacked Atop a Second Sub-package
NANYA TECHNOLOGY CORPORATION
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US116409452023
Method of Forming a Semiconductor Structure Including Forming a Buffer Structure Over a Metal Layer
NANYA TECHNOLOGY CORPORATION
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US116409482023
Microelectronic Devices and Apparatuses Having a Patterned Surface Structure
Micron Technology, Inc.
0 cites
US116213412023
Semiconductor Device and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
0 cites
US116108332023
Conductive Feature with Non-uniform Critical Dimension and Method of Manufacturing the Same
NANYA TECHNOLOGY CORPORATION
0 cites
US116055962023
Semiconductor Device Having Through Silicon Vias
NANYA TECHNOLOGY CORPORATION
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US116056122023
Method of Manufacturing Semiconductor Package
NANYA TECHNOLOGY CORPORATION
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US115879012023
Semiconductor Device with Redistribution Structure and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
0 cites
US115748912023
Semiconductor Device with Heat Dissipation Unit and Method for Fabricating the Same
NANYA TECHNOLOGY CORPORATION
0 cites