54 Patents
- US126160182026Graphene Barrier Layer of Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125506992026Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer and Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125435502026Interconnects Including Graphene Capping and Graphene Barrier Layers
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125001732025Interconnect Structure with Hybrid Barrier Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124314312025Conductive Structure Interconnects with Downward Projections
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124179812025Semiconductor Device Including Graphene Interconnect and Method of Making the Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124128372025Interconnect Structure Including Topological Material
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123746372025Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123477762025Integrated Chip with Graphene Based Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123277602025Interconnect Structures Having Varied Materials
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123158112025Graphene Barrier Layer for Reduced Contact Resistance
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123005992025Method for Forming Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US122726232025Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122180602025Integrated Chip with Graphene Based Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122117882025Hybrid Interconnect Structure for Self Aligned Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122117992025Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122117402025Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121660262024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121598142024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121425572024Integrated Chip Having a Back-side Power Rail
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121130212024Graphene-assisted Low-resistance Interconnect Structures and Methods of Formation Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120948482024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US120682532024Semiconductor Structure with Two-dimensional Conductive Structures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US120682542024Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120626122024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120516832024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US120516452024Two 2D Capping Layers on Interconnect Conductive Structure to Increase Interconnect Structure Reliability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120274192024Semiconductor Device Including Liner Structure
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US119786632024Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer and Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119488372024Semiconductor Structure Having Vertical Conductive Graphene and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119293262024Method of Forming Graphene Barrier Layer in Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119087942024Protection Liner on Interconnect Wire to Enlarge Processing Window for Overlying Interconnect Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119013492024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118549872023Semiconductor Packages with Interconnection Features in a Seal Region and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118549442023Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118309102023Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117496432023Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117355132023Integrated Chip Having a Back-side Power Rail
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117282642023Hybrid Interconnect Structure for Self Aligned Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117216272023Graphene Layer for Reduced Contact Resistance
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117156892023Method of Forming Metal Interconnection
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117107002023Graphene-assisted Low-resistance Interconnect Structures and Methods of Formation Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116826202023Graded Metallic Liner for Metal Interconnect Structures and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US116826162023Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US116705952023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116520552023Interconnect Structure with Hybrid Barrier Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116409402023Methods of Forming Interconnection Structure Including Conductive Graphene Layers
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116055912023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116055582023Integrated Circuit Interconnect Structure Having Discontinuous Barrier Layer and Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US115519672023Via Structure and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites