Shimpei Obata

2 Patents

• US120210152024

  Thermosetting Resin Composition, Metal-clad Laminated Plate, Insulating Sheet, Printed Wiring Board, Method of Manufacturing Printed Wiring Board, and Package Substrate

  PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.

  0 cites
• US116475832023

  Prepreg, Metal-clad Laminated Board, and Printed Wiring Board

  PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., Ltd.

  0 cites