Patents/Inventors

Shih-shen Lee

New TaipeiTW3 patents

3 Patents

US125572132026
Micro-roughened Electrodeposited Copper Foil and Copper Clad Laminate
CO-TECH DEVELOPMENT Corp.
0 cites
US121208162024
Micro-roughened Electrodeposited Copper Foil and Copper Clad Laminate
CO-TECH DEVELOPMENT Corp.
0 cites
US116555552023
Advanced Reverse Treated Electrodeposited Copper Foil and Copper Clad Laminate Using the Same
CO-TECH DEVELOPMENT Corp.
0 cites