Patents/Inventors

Shih-peng Tai

Xinpu TownshipTW17 patents

13 Patents

US125987572026
Structure and Formation Method of Package with Hybrid Interconnection
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125990112026
Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US125504172026
Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US125436042026
Adding Sealing Material to Wafer Edge for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123745962025
Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123746022025
Semiconductor Structure Having Through Substrate via and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123478012025
Semiconductor Package and Method for Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122726132025
Thermal Structure for Semiconductor Device and Method of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US121762992024
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119554012024
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116826472023
Semiconductor Package and Method for Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116263412023
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115878872023
Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites