Shih-pei Chou

12 Patents

• US124566612025

  Semiconductor Structure Having a Silicon Active Layer Formed Over a Sige Etch Stop Layer and an Insulating Layer with a Through Silicon via (TSV) Passed Therethrough

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US124245772025

  Isolation Structure for Bond Pad Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US124191242025

  Method for Forming Light Pipe Structure with High Quantum Efficiency

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US124009842025

  Isolation Structure for Bond Pad Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US123411152025

  Bond Pad Structure with Reduced Step Height and Increased Electrical Isolation

  Taiwan Semiconductor Manufacturing Company, Ltd.

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• US123176132025

  Self Aligned Grids in BSI Image Sensor

  Taiwan Semiconductor Manufacturing Company, Ltd.

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• US121659112024

  Method for Forming a Semiconductor-on-insulator (SOI) Substrate

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118551592023

  Method for Forming Thin Semiconductor-on-insulator (SOI) Substrates

  Taiwan Semiconductor Manufacturing Company, Ltd.

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• US118307642023

  Method for Forming a Semiconductor-on-insulator (SOI) Substrate

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117769852023

  Method of Forming Self Aligned Grids in BSI Image Sensor

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US117697782023

  Method for Forming Light Pipe Structure with High Quantum Efficiency

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US116949792023

  Isolation Structure for Bond Pad Structure

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites