Shih-ked Lee

6 Patents

• US124354122025

  High Density, Modulus, and Hardness Amorphous Carbon Films at Low Pressure

  Lam Research Corporation

  0 cites
• US122665422025

  Atomic Layer Etching for Subtractive Metal Etch

  Lam Research Corpporation

  0 cites
• US122495142025

  Carbon Based Depositions Used for Critical Dimension Control During High Aspect Ratio Feature Etches and for Forming Protective Layers

  Lam Research Corporation

  0 cites
• US120625372024

  High Etch Selectivity, Low Stress Ashable Carbon Hard Mask

  LAM RESEARCH CORPORATION

  0 cites
• US119357582024

  Atomic Layer Etching for Subtractive Metal Etch

  Lam Research Corporation

  0 cites
• US116705162023

  Metal-containing Passivation for High Aspect Ratio Etch

  Lam Research Corporation

  0 cites