Shiann-tsong Tsai

5 Patents

• US122666202025

  Manufacturing Method of Flip Chip Package Structure

  AMAZING COOL TECHNOLOGY Corp.

  0 cites
• US119675702024

  Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure

  Mediatek Inc.

  0 cites
• US119554432024

  Flip Chip Package Structure and Manufacturing Method Thereof

  AMAZING COOL TECHNOLOGY Corp.

  0 cites
• US118698492024

  Semiconductor Package with EMI Shielding Structure

  MEDIATEK Inc.

  0 cites
• US117054132023

  Semiconductor Package Having Improved Thermal Interface Between Semiconductor Die and Heat Spreading Structure

  MEDIATEK Inc.

  0 cites