Shiang Yang Ong

2 Patents

• US121366492024

  Deep Trench Isolation Structures with a Substrate Connection

  Globalfoundries Singapore Pte. Ltd.

  0 cites
• US119089302024

  Laterally-diffused Metal-oxide-semiconductor Devices with a Multiple-thickness Buffer Dielectric Layer

  Globalfoundries Singapore Pte. Ltd.

  0 cites