6 Patents
- US123538142025System-in-package Technology-based Process Design Method and System, Medium, and Device
Vayo (Shanghai) Technology Co., Ltd.
0 cites - US121118112024EDA Pad Package Library Updating/application Method and System, Medium and Terminal
Vayo (Shanghai) Technology Co. Ltd.
0 cites - 0 cites
- US119217762024Surface Mount Data Conversion Method, System, Medium and Device Based on Component Three-dimensional Database
CHINA RESOURCES MICROELECTRONICS (CHONGQING) Co. Ltd.
0 cites - US117757312023Stencil-avoidance Design Method and Device, Electronic Device and Storage Medium
VAYO (SHANGHAI) TECHNOLOGY CO., Ltd.
0 cites - US116049162023Method, System, and Electronic Device for Detecting Open/short Circuit of PCB Design Layout
VAYO (SHANGHAI) TECHNOLOGY CO., Ltd.
0 cites