Shenghua Huang

4 Patents

• US120339582024

  Semiconductor Device Including a Suspended Reinforcing Layer and Method of Manufacturing Same

  Western Digital Technologies, Inc.

  0 cites
• US120274972024

  Semiconductor Device with Unbalanced Die Stackup

  Western Digital Technologies, Inc.

  0 cites
• US119787132024

  Flip Chip Bump with Multi-pi Opening

  Western Digital Technologies, Inc.

  0 cites
• US119617782024

  Semiconductor Device Package Having Multi-layer Molding Compound and Method

  WESTERN DIGITAL TECHNOLOGIES, Inc.

  0 cites