9 Patents
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- US120741372024Multi-chip Package and Manufacturing Method Thereof
Industrial Technology Research Institute
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- US118549612023Package Substrate and Method of Fabricating the Same and Chip Package Structure
Unimicron Technology Corp.
0 cites - US116462702023Multi-chip Package and Manufacturing Method Thereof
Industrial Technology Research Institute
0 cites - US115879052023Multi-chip Package and Manufacturing Method Thereof
Industrial Technology Research Institute
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- US115692172023Image Sensor Package and Manufacturing Method Thereof
Industrial Technology Research Institute
0 cites