Patents/Inventors

Sheng-liang Kuo

HsinchuTW6 patents

6 Patents

US125885052026
Thermal and Mechanical Enhanced Thermal Module Structure on Heterogeneous Packages and Methods for Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123622582025
Thermal Module for a Semiconductor Package and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites
US123005732025
Semiconductor Device and Manufacturing Method Thereof
MEDIATEK Inc.
0 cites
US120876642024
Semiconductor Package Having Liquid-cooling Lid
MEDIATEK Inc.
0 cites
US117282322023
Semiconductor Package Having a Stiffener Ring
Mediatek Inc.
0 cites
US116409302023
Semiconductor Package Having Liquid-cooling Lid
MEDIATEK Inc.
0 cites