13 Patents
- US126220732026Hybrid Image Sensor Having Dies Bonded to Pixel Substrate
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US124631652025Bonding Structure and Manufacturing Method Therefor
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
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- US123289632025Semiconductor Device and Manufacturing Method Therefor
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123227072025Large Die Wafer, Large Die and Method of Forming the Same
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121522552024Ω-transaminase Mutant Obtained by DNA Synthetic Shuffling Combined Mutation and Use
ENZYMASTER (NINGBO) BIO-ENGINEERING CO., Ltd.
0 cites - USD10512562024Treadmill0 cites
- US120947042024Semiconductor Device and Method of Fabricating the Same
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118044582023Method of Fabricating Integrated Circuit Device
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117913672023Semiconductor Device and Method of Fabricating the Same
WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., Ltd.
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