Patents/Inventors

Sheng C. Li

Gilbert, AZUS8 patents

8 Patents

US123361972025
In-plane Inductors in IC Packages
Intel Corporation
0 cites
US122305632025
Method to Enable 30 Microns Pitch EMIB or Below
Intel Corporation
0 cites
US118625522024
Methods of Embedding Magnetic Structures in Substrates
Intel Corporation
0 cites
US118240132023
Package Substrate with Reduced Interconnect Stress
Intel Corporation
0 cites
US116768912023
Method to Enable 30 Microns Pitch EMIB or Below
Intel Corporation
0 cites
US116224482023
Sandwich-molded Cores for High-inductance Architectures
Intel Corporation
0 cites
US116107062023
Release Layer-assisted Selective Embedding of Magnetic Material in Cored and Coreless Organic Substrates
Intel Corporation
0 cites
US115812712023
Methods to Pattern TFC and Incorporation in the ODI Architecture and in Any Build Up Layer of Organic Substrate
Intel Corporation
0 cites