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Shenavia S. Howell
Chandler, AZ
US
2 patents
3 Patents
US11798861
2023
Integrated Heat Spreader (IHS) with Heating Element
Intel Corporation
0 cites
US11682605
2023
Integrated Circuit Packages with Asymmetric Adhesion Material Regions
Intel Corporation
0 cites
US11652061
2023
Package-level Backside Metallization (BSM)
Intel Corporation
0 cites