Patents/Inventors

Shawna M. Liff

Scottsdale, AZUS61 patents

58 Patents

US126223172026
Packaging Architecture for Modular Die Interoperability
Intel Corporation
0 cites
US125990332026
Quasi-monolithic Integrated Packaging Architecture with Mid-die Serializer/deserializer
Intel Corporation
0 cites
US125869062026
Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites
US125819682026
Package Architecture of Large Dies Using Quasi-monolithic Chip Layers
Intel Corporation
0 cites
US125819382026
Package Architecture for Quasi-monolithic Chip with Backside Power
Intel Corporation
0 cites
US125388412026
Quasi-monolithic Die Architectures
Intel Corporation
0 cites
US125002072025
Packaging Architecture with Intermediate Routing Layers
Intel Corporation
0 cites
US125001772025
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124698202025
Fine-grained Disaggregated Server Architecture
Intel Corporation
0 cites
US124245892025
Contiguous Shield Structures in Microelectronic Assemblies Having Hybrid Bonding
Intel Corporation
0 cites
US124179782025
Microelectronic Assemblies Having Backside Die-to-package Interconnects
Intel Corporation
0 cites
US124128812025
Microelectronic Assemblies
Intel Corporation
0 cites
US124069622025
Power Delivery Through Capacitor-dies in a Multi-layered Microelectronic Assembly
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US123897282025
Micro-led Displays Including Solder Structures and Methods
Intel Corporation
0 cites
US123811822025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US123411142025
Microelectronic Assemblies Having a Hybrid Bonded Interposer for Die-to-die Fan-out Scaling
Intel Corporation
0 cites
US123278272025
Microelectronic Assemblies
Intel Corporation
0 cites
US123278012025
Robust Mold Integrated Substrate
Intel Corporation
0 cites
US123158402025
Microelectronic Assemblies
Intel Corporation
0 cites
US123006662025
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US123006262025
Microelectronic Assemblies
Intel Corporation
0 cites
US122666822025
Capacitors and Resistors at Direct Bonding Interfaces in Microelectronic Assemblies
Intel Corporation
0 cites
US121990632025
Microelectronic Assemblies
Intel Corporation
0 cites
US121990672025
Scalable Embedded Silicon Bridge via Pillars in Lithographically Defined Vias, and Methods of Making Same
Intel Corporation
0 cites
US121990182025
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US121839612024
Methods for Conductively Coating Millimeter Waveguides
Intel Corporation
0 cites
US121763232024
Microelectronic Assemblies
Intel Corporation
0 cites
US121659622024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121425102024
Carrier for Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121193172024
Singulation of Microelectronic Components with Direct Bonding Interfaces
Intel Corporation
0 cites
US121192912024
Hermetic Sealing Structures in Microelectronic Assemblies Having Direct Bonding
Intel Corporation
0 cites
US121130482024
Microelectronic Assemblies
Intel Corporation
0 cites
US121070602024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corproation
0 cites
US120806522024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US120626312024
Microelectronic Assemblies with Inductors in Direct Bonding Regions
Intel Corporation
0 cites
US120574022024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US119904482024
Direct Bonding in Microelectronic Assemblies
Intel Corporation
0 cites
US119844392024
Microelectronic Assemblies
Intel Corporation
0 cites
US119675802024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US119554342024
Ultra Small Molded Module Integrated with Die by Module-on-wafer Assembly
Intel Corporation
0 cites
US119160202024
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US119160062024
Microelectronic Assemblies Having an Integrated Voltage Regulator Chiplet
Intel Corporation
0 cites
US119013302024
Microelectronic Assemblies
Intel Corporation
0 cites
US118814572024
Semiconductor Packaging with High Density Interconnects
Tahoe Research, Ltd.
0 cites
US118701632024
Antenna Package Using Ball Attach Array to Connect Antenna and Base Substrates
Intel Corporation
0 cites
US117912772023
Microelectronic Assemblies
Intel Corporation
0 cites
US117697512023
Microelectronic Assemblies
Intel Corporation
0 cites
US117569432023
Microelectronic Assemblies
Intel Corporation
0 cites
US117496422023
Microelectronic Assemblies with Communication Networks
Intel Corporation
0 cites
US117216492023
Microelectronic Assemblies
Intel Corporation
0 cites
US116769002023
Electronic Assembly That Includes a Bridge
Intel Corporation
0 cites
US116160472023
Microelectronic Assemblies
Intel Corporation
0 cites
US116056032023
Microelectronic Package with Radio Frequency (RF) Chiplet
Intel Corporation
0 cites
US116005942023
Microelectronic Assemblies
Intel Corporation
0 cites
US115812822023
Serializer-deserializer Die for High Speed Signal Interconnect
Intel Corporation
0 cites
US115520352023
Electronic Package with Stud Bump Electrical Connections
Intel Corporation
0 cites