Patents/Inventors

Shawna Liff

Scottsdale, AZUS20 patents

22 Patents

US124567022025
Device, Method and System to Mitigate Stress on Hybrid Bonds in a Multi-tier Arrangement of Chiplets
Intel Corporation
0 cites
US124245432025
Selective Interconnects in Back-end-of-line Metallization Stacks of Integrated Circuitry
Intel Corporation
0 cites
US123622842025
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US123277752025
Thermal Performance in Hybrid Bonded 3D Die Stacks
Intel Corporation
0 cites
US123157942025
Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites
US123005792025
Liquid Cooled Interposer for Integrated Circuit Stack
Intel Corporation
0 cites
US122887462025
Skip Level Vias in Metallization Layers for Integrated Circuit Devices
Intel Corporation
0 cites
US122726562025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US122668402025
Waveguide Interconnects for Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US122242612025
Mixed Hybrid Bonding Structures and Methods of Forming the Same
Intel Corporation
0 cites
US122059022025
High-density Interconnects for Integrated Circuit Packages
Intel Corporation
0 cites
US121990482025
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US120149902024
Composite Interposer Structure and Method of Providing Same
Intel Corporation
0 cites
US118308312023
Semiconductor Package Including a Modular Side Radiating Waveguide Launcher
Intel Corporation
0 cites
US118240182023
Heterogeneous Nested Interposer Package for IC Chips
0 cites
US117496492023
Composite IC Chips Including a Chiplet Embedded Within Metallization Layers of a Host IC Chip
Intel Corporation
0 cites
US117355332023
Heterogeneous Nested Interposer Package for IC Chips
Intel Corporation
0 cites
US117355512023
Aligned Core Balls for Interconnect Joint Stability
Intel Corporation
0 cites
US116949862023
Vias in Composite IC Chip Structures
Intel Corporation
0 cites
US116643032023
Interconnection Structure Fabrication Using Grayscale Lithography
Intel Corporation
0 cites
US115812382023
Heat Spreading Layer Integrated Within a Composite IC Die Structure and Methods of Forming the Same
Intel Corporation
0 cites
US115694282023
Superconducting Qubit Device Packages
Santa Clara
0 cites