4 Patents
- US125572102026Electronic Apparatus Minimizing Differential Thermal Contraction for Cryogenic Quantum Computers
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US118044422023Combined Backing Plate and Housing for Use in Bump Bonded Chip Assembly
International Business Machines Corporation
0 cites - US117358022023Electroplated Metal Layer on a Niobium-titanium Substrate
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites - US116769032023Combined Backing Plate and Housing for Use in Bump Bonded Chip Assembly
INTERNATIONAL BUSINESS MACHINES CORPORATION
0 cites