106 Patents
- US126160182026Graphene Barrier Layer of Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125819282026Interconnect Structure with Protective Etch-stop
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125640452026Semiconductor Device Structure with Interconnect Structure Having Air Gap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125506942026Selective Deposition for Integrated Circuit Interconnect Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125435512026Selective Formation of Conductor Nanowires
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125435502026Interconnects Including Graphene Capping and Graphene Barrier Layers
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125387732026Semiconductor Structure Having Self-aligned Conductive Structure and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125124042025Interconnect Structure Including Contact via Over Barrier Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125124032025Method of Forming Semiconductor Device Comprising Conductive Feature, Dielectric Layer Adjacent Conductive Feature, and Etch Stop Layer on Top Surface of Dielectric Layer
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US125001732025Interconnect Structure with Hybrid Barrier Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124827432025Interconnect Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124827032025Semiconductor Device Having Thermally Conductive Air Gap Structure and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124631342025Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124313862025Semiconductor Device Having Metallization Layer with Low Capacitance and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124128042025Semiconductor Structure with Improved Heat Dissipation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124127802025Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123946332025Method of Fabricating Semiconductor Device with Reduced Trench Distortions
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123811432025Self-align via Structure by Selective Deposition
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123811132025Semiconductor Device Structure Having Air Gap and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123746372025Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123622332025Methods of Performing Chemical-mechanical Polishing Process in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123477762025Integrated Chip with Graphene Based Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123426002025Titanium-containing Diffusion Barrier for CMP Removal Rate Enhancement and Contamination Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123277602025Interconnect Structures Having Varied Materials
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123158112025Graphene Barrier Layer for Reduced Contact Resistance
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123082862025Interconnect Structures Including Air Gaps
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122781432025Method of Providing a Workpiece Including Low Resistance Interconnect Low-resistance Interconnect
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122725972025Semiconductor Interconnection Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122726232025Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122665652025Integrated Chip with an Etch-stop Layer Forming a Cavity
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122495552025Semiconductor Device Package Including a Thermal Conductive Layer and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122305372025Semiconductor Device Structure Having Air Gap and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122305342025Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US122180602025Integrated Chip with Graphene Based Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122117882025Hybrid Interconnect Structure for Self Aligned Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122117992025Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122117402025Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122058862025Hybrid Method for Forming Semiconductor Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121762462024Dielectric Capping Structure Overlying a Conductive Structure to Increase Stability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121660262024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121659452024Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121598142024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121425572024Integrated Chip Having a Back-side Power Rail
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US121320002024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121130212024Graphene-assisted Low-resistance Interconnect Structures and Methods of Formation Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120948152024Semiconductor Structure Having Dielectric-on-dielectric Structure and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120948162024Semiconductor Structure Having Deep Metal Line and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120948482024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120947642024Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US120740602024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120740842024Heat Dispersion Layers for Double Sided Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120682482024Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120681932024Semiconductor Device Structure with Interconnect Structure Having Air Gap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120682542024Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120625722024Semiconductor Device Having Metallization Layer with Low Capacitance and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120516832024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120338892024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120092022024Using a Self-assembly Layer to Facilitate Selective Formation of an Etching Stop Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- 0 cites
- US120027492024Barrier and Air-gap Scheme for High Performance Interconnects
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119904002024Capping Layer Overlying Dielectric Structure to Increase Reliability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119729752024Semiconductor Device Structure Having Air Gap and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119675522024Methods of Forming Interconnect Structures in Semiconductor Fabrication
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US119357832024Selective Deposition for Integrated Circuit Interconnect Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119293262024Method of Forming Graphene Barrier Layer in Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119292582024Via Connection to a Partially Filled Trench
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119233062024Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119232432024Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119087922024Semiconductor Device Comprising Cap Layer Over Dielectric Layer and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US119087942024Protection Liner on Interconnect Wire to Enlarge Processing Window for Overlying Interconnect Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119087892024Selective Formation of Conductor Nanowires
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119013492024Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119012212024Interconnect Strucutre with Protective Etch-stop
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118942382024Method of Fabricating Semiconductor Device with Reduced Trench Distortions
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118605502024Multi-metal Fill with Self-aligned Patterning and Dielectric with Voids
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US118549632023Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118548202023Spacer Etching Process for Integrated Circuit Design
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118549442023Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118549872023Semiconductor Packages with Interconnection Features in a Seal Region and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118108152023Dielectric Capping Structure Overlying a Conductive Structure to Increase Stability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117696952023Semiconductor Structure Including Low-resistance Interconnect and Integrated Circuit Device Having the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117641062023Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US117568782023Self-aligned via Structure by Selective Deposition
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US117496432023Semiconductor Packages and Methods for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117422392023Methods of Performing Chemical-mechanical Polishing Process in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117355132023Integrated Chip Having a Back-side Power Rail
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117282642023Hybrid Interconnect Structure for Self Aligned Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117216272023Graphene Layer for Reduced Contact Resistance
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117156892023Method of Forming Metal Interconnection
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117107002023Graphene-assisted Low-resistance Interconnect Structures and Methods of Formation Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116705952023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116580922023Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116520552023Interconnect Structure with Hybrid Barrier Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116409282023Heat Dispersion Layers for Double Sided Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116409402023Methods of Forming Interconnection Structure Including Conductive Graphene Layers
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116409242023Structure and Method for Interconnection with Self-alignment
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US115691242023Interconnect Structure Having an Etch Stop Layer Over Conductive Lines
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115575112023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115453892023Titanium-containing Diffusion Barrier for CMP Removal Rate Enhancement and Contamination Reduction
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites