Patents/Inventors

Shashi Vyas

Euclid, OHUS11 patents

3 Patents

US126047862026
Method of Atomic Diffusion Hybrid Bonding and Apparatus Made from Same
Intel Corporation
0 cites
US125506982026
Via Profile Shrink for Advanced Integrated Circuit Structure Fabrication
Intel Corporation
0 cites
US122495772025
Cap Structure for Interconnect Dielectrics and Methods of Fabrication
Intel Corporation
0 cites