46 Patents
- US125819282026Interconnect Structure with Protective Etch-stop
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125640452026Semiconductor Device Structure with Interconnect Structure Having Air Gap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US125506942026Selective Deposition for Integrated Circuit Interconnect Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US125387732026Semiconductor Structure Having Self-aligned Conductive Structure and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125124032025Method of Forming Semiconductor Device Comprising Conductive Feature, Dielectric Layer Adjacent Conductive Feature, and Etch Stop Layer on Top Surface of Dielectric Layer
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US124827032025Semiconductor Device Having Thermally Conductive Air Gap Structure and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124827432025Interconnect Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124631342025Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124313862025Semiconductor Device Having Metallization Layer with Low Capacitance and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124127802025Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124128042025Semiconductor Structure with Improved Heat Dissipation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123811132025Semiconductor Device Structure Having Air Gap and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123811432025Self-align via Structure by Selective Deposition
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123082862025Interconnect Structures Including Air Gaps
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122781432025Method of Providing a Workpiece Including Low Resistance Interconnect Low-resistance Interconnect
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US122725972025Semiconductor Interconnection Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122495552025Semiconductor Device Package Including a Thermal Conductive Layer and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122305372025Semiconductor Device Structure Having Air Gap and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121762462024Dielectric Capping Structure Overlying a Conductive Structure to Increase Stability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121659452024Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121320002024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120947642024Interconnect Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120948152024Semiconductor Structure Having Dielectric-on-dielectric Structure and Method for Forming the Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120740602024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120740842024Heat Dispersion Layers for Double Sided Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120681932024Semiconductor Device Structure with Interconnect Structure Having Air Gap
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120682482024Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120625722024Semiconductor Device Having Metallization Layer with Low Capacitance and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120338892024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120092022024Using a Self-assembly Layer to Facilitate Selective Formation of an Etching Stop Layer
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US120027492024Barrier and Air-gap Scheme for High Performance Interconnects
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119904002024Capping Layer Overlying Dielectric Structure to Increase Reliability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119357832024Selective Deposition for Integrated Circuit Interconnect Structures
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119232432024Semiconductor Structure Having Air Gaps and Method for Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119087922024Semiconductor Device Comprising Cap Layer Over Dielectric Layer and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US119012212024Interconnect Strucutre with Protective Etch-stop
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US118549632023Semiconductor Interconnection Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118108152023Dielectric Capping Structure Overlying a Conductive Structure to Increase Stability
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117696952023Semiconductor Structure Including Low-resistance Interconnect and Integrated Circuit Device Having the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117568782023Self-aligned via Structure by Selective Deposition
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
0 cites - US116580922023Thermal Interconnect Structure for Thermal Management of Electrical Interconnect Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116409282023Heat Dispersion Layers for Double Sided Interconnect
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US115575112023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites